According to Digitimes, Apple has already commissioned the assembly of the A8 processor, rumored to equip the iPhone 6, to three Taiwanese companies.
Amkor Technology and STATS ChipPAC will provide 40 % of the supply, with the remaining 20% produced by Advanced Semiconductor Engineering (ASE).
The report notes that the new A8 chip will be a package-on-package (PoP) SoC solution, with the processors and mobile DRAM combining in a single package.
Taiwan Semiconductor Manufacturing Company ( TSMC ) will probably also have wafer-bumping orders for the processor and the production for the A8 chip based on the 20mm process technology should start in the second quarter.
Recent report stated that TSMC would produce fingerprint sensors for the iPhone 6 in a larger factory to increase production efficiency.