A new patent application submitted by the company describes a method by which the mechanism that connects a SIM card to an iPhone logic board could be reduced.
This would make the smartphone a lot thinner.
The patent reads: “The electronic device may also include a circuit board having a top surface, a bottom surface, and a pocket through the top surface that may expose a middle surface of the circuit board between the top surface and the bottom surface. In other embodiments, there is provided a circuit board that may include a top surface, a bottom surface, and a middle surface positioned between the top surface and the bottom surface. …forming a recess through a top surface of a circuit board for exposing a middle surface of the circuit board positioned between the top surface and a bottom surface of the circuit board.”
With recent iPhone generations, the mobile operators have accepted the reduction of SIM cards, and the company now seems to be working on offering a thinner iPhone by reducing the Sim card once more.
Rumors so far indicate that Apple plans to make the iPhone 6 thinner than the iPhone 5S, so maybe we’ll see this new mechanism in the future Apple smartphone.