iPhone 6S/iPhone 7 rumors: release date, specs, features and more

iPhone concept

In early November a report by the Economic Daily News claimed that Apple is considering implementing a 3D display that wouldn’t need special glasses for proper viewing of content.

In case a 3D screen was integrated in the next iPhone, it would replace the current in-cell display technology.

Cupertino would probably collaborate with touch screen manufacturer TPK in the production of a 3D screen.

Also regarding the smartphone’s possible new specs, Daring Fireball‘s John Gruber believes the next iPhone will bring the “biggest camera jump ever.”

The analyst claimed to have heard “from a birdie of a birdie” that the future iPhone camera will feature a major overhaul.

“The specific thing I heard is that next year’s camera might be the biggest camera jump ever,” Gruber said. “I don’t even know what sense this makes, but I’ve heard that it’s some kind of weird two-lens system where the back camera uses two lenses and it somehow takes it up into DSLR quality imagery.”

According to a report by China Economic Weekly, Foxconn, one of the main iPhone and iPad makers, is building a plant in the Chinese province of Henan for the production of sapphire displays.

The plot of land is reportedly adjacent to one of the factories where the iPhone 6 is produced.

The sapphire screens are said to be meant to be integrated in the next iPhone models in 2015.

Another report from Asia claims that production of A9 processor hasn’t kicked off yet and a launch towards the end of the year is very likely.

In addition, new rumors suggest the potential launch of a 4-inch iPhone next year in order to bring back the ease of one-handed operability.

Another reason for going back to a smaller-sized iPhone would be that Apple may want to respond to female users who are in constant demand of smaller devices.

Finally, the latest rumors come from Korean site Electronic Times which reports that Cupertino has appealed to Samsung for the manufacturing of the A9 processor in its Austin plant in Texas, United States.

The chip will be engraved using their 14nm FinFET technology and Samsung is said to be responsible for two thirds of the production of the A9 chip, with the rest assigned to TSMC.