Steve Hemmerstoffer, known as an editor of Nowhereelse.fr, has posted images of a bare main logic board on Chinese microblogging site Weibo.
No other information is offered beside the images, only that the component belongs to the iPhone 7.
— Steve Hemmerstoffer (@stagueve) August 8, 2016
The motherboard will incorporate the A10 processor produced by TSMC with a variant of the 16-nanometer manufacturing process already used on the iPhone 6s CPU.
The leaked photos also show that there is no possibility for dual-SIM smartphone.
According to recent rumors, other enhancements planned for the new iPhone would be the elimination of the headphone jack, the repositioning of the antenna bands and the existence of a new color variant.